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Vendor News

Apple and Qualcomm Kiss and Make Up

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Apple and Qualcomm Kiss and Make Up

The legal battle over patent licensing going on between Apple and Qualcomm since January 2017 comes to a close, as the two companies drop all litigation in favour of a 6-year license agreement and a "multi-year" supply of wireless chips.

The two companies do not reveal what brought the sudden end to the bitter feud, especially since yet another round of court litigation had just started earlier this week. It is probable both Apple and Qualcomm simply tired of spending on corporate and legal maneuvering, as until now neither of the two budged on their position on iPhone patent royalties.

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Pure Storage Buys Compuverde

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Pure Storage Buys Compuverde

Pure Storage gains more hybrid storage capabilities through the acquisition of Sweden-based Compuverde, a developer of file software solutions for enterprises and cloud providers.

Through the purchase, Pure Storage plans to further expand file capabilities, allowing it to offer "true hybrid architectures" for customers wanting to leverage data on-premises, in the cloud or both. Compuverde also brings an ecosystem of technology partnerships, not to mention a client base of global organisations in the telecom, financial services and media industries.

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Intel Presents 2nd Gen Xeon Scalable Processors

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Intel Presents 2nd Gen Xeon Scalable Processors

Intel further cements its datacentre strategy at the "Data-Centric Innovation Day" event with the launch of the 2nd generation Xeon Scalable processors aimed at enterprise, cloud and communication service providers.

Previously dubbed "Cascade Lake," Xeon Scalable processors support Optane DC persistent memory, bringing support for up to 36TB of system-level memory capacity in combination with traditional DRAM. Turbo Boost 2.0 technology ramps up to 4.4GHz, alongside memory subsystem enhancements with support for DDR4-2933 MT/s and 16 Gb DIMM densities.

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Samsung Develops Smaller DRAM

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Samsung Develops Smaller DRAM

Samsung announces the development of an industry first-- 3rd generation 10-nanometer class (aka 1z-nm) 8Gb DDR4 DRAM, the smallest process node for memory produced without need for extreme ultraviolet lithography (EUVL).

Set for mass production within H2 2019, the 1z-nm process allows Samsung to make 20% more 8Gb DDR4 chips per wafer compared to the 2nd generation 10nm process (aka 1y-nm). An increase in the dies per wafer means the 8Gb DDR4 memory produced is around 20% smaller than the previous generation, bringing about a decrease in production costs and, ultimately, cheaper DRAM prices on the consumer side.

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Samsung Produces HBM2E Memory

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Samsung Produces HBM2E Memory

Samsung takes to the Nvidia GPU Technology Conference (GTC) to present a High Bandwidth Memory (HBM2E) product-- Flashbolt a high-performance DRAM claiming data transfers reaching up to 3.2Gbps per pin.

Initially aimed for use in next-gen supercomputers, graphics systems and AI, HBM2E offers a 33% increase in speed over the previous generation HBM2, with a density of 16Gb per die (or double the capacity of the previous generation). Such improvements, Samsung says, allow a single HBM2E package to provide 410GBps data bandwidth and 16GB of memory.

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Nvidia Buys Mellanox

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Nvidia Buys Mellanox

Nvidia looks to grow further into datacentre space as it shells out $6.9 billion for Mellanox Technologies, the Israel-based maker of end-to-end ethernet and InfiniBand smart interconnect solutions and services.

“The emergence of AI and data science, as well as billions of simultaneous computer users, is fueling skyrocketing demand on the world’s datacentres,” Nvidia says. “Addressing this demand will require holistic architectures that connect vast numbers of fast computing nodes over intelligent networking fabrics to form a giant datacentre-scale compute engine."

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Intel Claims "Milestone in Moving Data"

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Intel Claims

Intel announces the Compute Express Link (CXL)-- an interconnect technology designed to improve performance and remove bottlenecks between CPUs and other system components, such as GPUs, memory and FPGAs.

The result of 4 years of development by Intel, CXL is an open technology belonging to the CXL Consortium, an industry body formed in collaboration Alibaba, Cisco, Dell EMC, Facebook, Google, Hewlett Packard Enterprise, Huawei and Microsoft with the aim to promote and push adoption of the technology.

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